AEP invested in spouted bed electrode plating technology to address the continuing miniaturization of electronic parts. The spouted bed plating process utilizes a solution jet that circulates the parts throughout the plating chamber.
![Spouted Bed Electrode Plating Spouted Bed Electrode Plating](https://i0.wp.com/americanelectro.com/wp-content/uploads/2019/02/119_aes.jpg?resize=1024%2C683&ssl=1)
![085_aes 085_aes](https://i0.wp.com/americanelectro.com/wp-content/uploads/2019/02/085_aes.jpg?resize=1024%2C683&ssl=1)
Spouted bed electrode plating technology is an effective tool for plating parts that are smaller than 1 cm in any single dimension. This process has been very helpful in achieving uniform plating thicknesses and enhanced ID coverage.
![019_aes 019_aes](https://i0.wp.com/americanelectro.com/wp-content/uploads/2019/02/019_aes.jpg?resize=1024%2C683&ssl=1)
![088_aes 088_aes](https://i0.wp.com/americanelectro.com/wp-content/uploads/2019/02/088_aes.jpg?resize=1024%2C683&ssl=1)